Method and apparatus for removing particles from the surface of a semiconductor wafer
AssigneePulseForge Inc.
InventorsDavid Alex Rose, Kurt A. Schroder
Life of this patent
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Abstract
A method for removing particles from a semiconductor wafer surface is disclosed. A wafer is being spun on a spin coater contained within a condensing environment. Liquid vapor is then infused into the condensing environment to allow some of the liquid vapor to be condensed onto a surface of the wafer on which particles may adhere while the wafer is being spun. Next, a set of light pulses is applied to the surface of the spinning wafer. Finally, an electric grid is utilized to remove the particles off the surface of the wafer.
Claims4
An apparatus for removing particles from a surface of a semiconductor wafer, said apparatus comprising:
- an enclosure having a condensing environment;
- a spin coater for spinning said wafer contained within said enclosure having a condensing environment;
- a vapor diffuser for infusing a liquid vapor into said enclosure to allow some of said liquid vapor to be condensed onto a surface of said wafer on which particles may adhere while said wafer is being spun;
- a flashlamp for emitting a plurality of light pulses to said surface of said spinning wafer, each light pulse at an angular location across a radius of said spinning wafer after a predetermined amount of time has lapsed as determined by a charging rate of capacitors located within said flashlamp for delivering said each light pulse, until an entire surface of said spinning wafer has received at least one light pulse;
- an encoder to determine said angular position of said spinning wafer, and a number of rotations of said spinning wafer;
- and
- an electric grid for carrying said particles off said surface of said wafer.
Dependencies are inferred from the claim text.