Roughened Carrier for Debonding of Bonded Stack

A reusable carrier structure for temporarily carrying electronics structures to be debonded from the carrier structure by flashlamp illumination in photonic debonding, the reusable carrier structure comprising:

• an electronics structure carrier configured to temporarily carry the electronics structures in multiple temporary bond-debond use cycles of the electronics structure carrier, the electronics structure carrier comprising a first light-receiving face and a second face, the light-receiving face being configured for receiving light from the flashlamp illumination, the second face being located generally opposite the first light-receiving face, the second face comprising a roughened surface, the electronics structure carrier comprising a carrier body configured to permit transmission of light from the flashlamp illumination via the first light-receiving face to pass through the carrier body toward the second face, the roughened surface of the second face having an average surface roughness between about 50nm and about 5 microns to facilitate photonic debonding of the electronics structures from the electronics structure carrier.