Method and apparatus for temporarily bonding and debonding electronics structures relative to carrier

A method of processing an electronics structure comprising:

• providing a temporary stack comprising:
• a reusable carrier structure comprising a carrier body and a heat-generating layer carried by the carrier body on a first side of the carrier structure, the carrier structure defining a bonding surface on the first side;
• an electronics structure temporarily carried by the carrier structure on the first side;
• and
• a bonding layer configured to temporarily bond the electronics structure to the bonding surface, the bonding layer comprising at least one adhesive material and at least one gas-generating material, each one of the at least one gas-generating material having a respective gasification temperature that is lower than a respective gasification temperature of each one of the at least one adhesive material;
• exposing the heat-generating layer to one or more pulses of debonding energy that cause the at least one gas-generating material to generate gas;
• and
• separating the electronics structure from the carrier structure after the gas is generated.

A temporary stack for temporarily carrying an electronics structure for processing, the temporary stack comprising:

• a reusable carrier structure comprising a carrier body and a heat-generating layer carried on the carrier body on a first side of the carrier structure, the carrier structure defining a bonding surface on the first side;
• an electronics structure temporarily carried by the carrier structure on the first side;
• and
• a bonding layer configured to temporarily bond the electronics structure to the bonding surface;
• wherein the heat-generating layer is configured to generate a debonding heat upon exposure to one or more pulses of debonding energy;
• wherein the bonding layer comprises at least one adhesive material and at least one gas-generating material configured to generate gas upon exposure to the debonding heat;
• and
• wherein the carrier is configured to transfer heat across the bonding surface and into the bonding layer with a substantially uniform energy distribution.