Method for connecting surface-mount electronic components to a circuit board

A system for connecting electronic components to a substrate, said system comprising:

• a capacitor bank;
• a capacitor-bank-charging power supply for charging said capacitor bank;
• an IGBT-based switching device;
• a frequency controller;
• a flashlamp for emitting light pulses, wherein said flashlamp receives charges from said capacitor bank via said IGBT-based switching device while said IGBT-based switching device is being switched on-and-off repeatedly by said frequency controller in order to modulate the flow of said charge from said capacitor bank to said flashlamp, which in turn switches said flashlamp on and off;
• a photodiode for measuring a power of a light pulse from said flashlamp;
• an infrared camera for measuring a temperature of an electronic component being soldered onto a substrate;
• and
• a processor, in response to said measured temperature of said electronic component, adaptively adjusting a duty cycle of a next light pulse via said frequency controller according to a radiant exposure derived from said measured power of said light pulse from said flashlamp.