Y10T 29/49172
By molding of insulating material
Official title: by molding of insulating material
Y10T29/49172 (By molding of insulating material) appears on 504 US grants and 348 published applications in this corpus.
Search patents in Y10T- Granted patents
- 504
- Published applications
- 348
- Assignees
- 256
- Inventors
- 744
- Latest grant
- 1 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 8 | 0 |
| 1987 | 3 | 0 |
| 1988 | 7 | 0 |
| 1989 | 11 | 0 |
| 1990 | 9 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 11 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 14 | 0 |
| 1997 | 8 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 13 | 8 |
| 2002 | 26 | 37 |
| 2003 | 32 | 42 |
| 2004 | 32 | 25 |
| 2005 | 22 | 35 |
| 2006 | 26 | 24 |
| 2007 | 37 | 17 |
| 2008 | 19 | 30 |
| 2009 | 16 | 20 |
| 2010 | 26 | 24 |
| 2011 | 21 | 20 |
| 2012 | 13 | 13 |
| 2013 | 24 | 17 |
| 2014 | 20 | 19 |
| 2015 | 15 | 5 |
| 2016 | 11 | 7 |
| 2017 | 4 | 0 |
| 2018 | 2 | 2 |
| 2019 | 4 | 1 |
| 2020 | 1 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Electrophysiology catheter design1 Oct 2024US 12,102,436 B2Medtronic Ablation Frontiers LLC
- Method of forming an integrated resonator with a mass bias24 Oct 2023US 11,799,436 B2Texas Instruments Incorporated
- Electrophysiology catheter design16 Mar 2021US 10,945,625 B2Medtronic Ablation Frontiers LLC
- Implantable electric stimulation system and methods of making and using22 Sep 2020US 10,780,263 B2Boston Scientific Neuromodulation Corporation
- Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices31 Dec 2019US 10,518,490 B2Board of Regents, The University of Texas System
- Electrophysiology catheter design26 Dec 2024US 2024/0423524 A1Medtronic Ablation Frontiers LLC
- Electrophysiology catheter design3 Jun 2021US 2021/0161453 A1Medtronic Ablation Frontiers LLC
- Method of Forming an Integrated Resonator with a Mass Bias19 Dec 2019US 2019/0386627 A1Texas Instruments Incorporated
- Electrophysiology catheter design15 Nov 2018US 2018/0325399 A1Medtronic Ablation Frontiers LLC
- Wire overmold device and method of forming wire overmold device4 Oct 2018US 2018/0287363 A1Littelfuse, Inc.
Most cited
By later US patents
- Method for making semiconductor device having no die supporting surface430US 5,474,958 AMotorola, Inc. · 1995
- Arrays of optoelectronic devices and method of making same426US 5,660,461 AQuantum Devices, Inc. · 1997
- Ultra high density integrated circuit packages method357US 5,279,029 AStaktek Corporation · 1994
- Method for encapsulating semiconductor components using temporary substrates327US 4,530,152 ACompagnie Industrielle des Telecommunications Cit-Alcatel · 1985
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007