Wire overmold device and method of forming wire overmold device
AssigneeLittelfuse, Inc.
InventorJay KRUGER
Life of this patent
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Abstract
A wire overmold device including a carrier body having a distal end and a proximal end, a wire cap configured to engage the distal end of the carrier body, at least one of a jacketed cable and one or more wires at least partially enclosed between the wire cap and the carrier body, and an overmold formed over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body, wherein the wire cap and the distal end of the carrier body protrude from the overmold.
Claims10
A method for forming a wire overmold device, the method comprising:
- inserting one or more electronic components and at least one of a jacketed cable and one or more wires in a carrier body, the carrier body having a distal end and a proximal end;
- at least partially enclosing the at least one of the jacketed cable and the one or more wires between a wire cap and the carrier body;
- forming an overmold over the proximal end of the carrier body and at least portions of the wire cap and the distal end of the carrier body;
- wherein the wire cap and the distal end of the carrier body protrude from the overmold.
The method according to claim 11, wherein the overmold is formed over a bushing, the bushing being adjacent to the carrier body.
Dependencies are inferred from the claim text.