Method for encapsulating semiconductor components using temporary substrates
AssigneeCompagnie Industrielle des Telecommunications Cit-Alcatel
InventorsGeorges Roche, Jacques Lantaires
Life of this patent
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Abstract
In the manufacture of a semiconductor component, connection areas adapted to connect the component externally are formed by a metal array (3, 4) deposited on a conductive layer (6) of low melting point alloy, itself deposited on a metal temporary substrate (7). Each component chip (1) is placed in position and connected and then immobilized by means of a hardenable resin (5). The temporary substrate (7) is then removed by melting the alloy layer (6) to expose the surfaces of the connection areas (3, 4) for making external electrical and/or thermal connections to the encapsulated component.
Claims8
A method of forming encapsulated semiconductor components comprising the steps of:
- depositing a conductive layer of low melting point alloy on a metal temporary substrate,
- depositing a metal array on said conductive layer of low melting point alloy to form connection areas to permit said components to be connected externally,
- placing each component chip in position on said metal array,
- electrically connecting each component chip to said connection area,
- immobilizing the components by molding or pouring a hardenable resin over each component consisting of a chip, its electrical connections and its connection areas, and
- hardening said resin, and
- melting the alloy layer to permit removal of the temporary substrate and expose the surface of the connection areas for permitting external electrical and/or thermal connections to be made to said encapsulated components.
A method of encapsulating semiconductor components including component chips, said method comprising the steps of:
- depositing a low melting point alloy layer on a metal temporary substrate,
- depositing metal on the alloy layer to form a connection array,
- fitting said chips to said deposited metal and wiring them to the connection areas of said connection array,
- molding or pouring a hardenable resin over each component consisting of a chip, its connecting wires and its connection areas,
- hardening the resin, and
- melting the alloy to separate the temporary substrate and the metal connection array to expose the surfaces of the connection areas for permitting external electrical and/or thermal connections to be made to the component whose surfaces are tinned by the molten alloy.
Dependencies are inferred from the claim text.