Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices

A system for making a three-dimensional electronic or electromechanical device, said system comprising:

• a three-dimensional printer configured to create a three-dimensional thermoplastic substrate of said electronic or electromechanical device by depositing a thermoplastic substrate material in a layer-by-layer fashion;
• and
• a first machine comprising a wire-feed and cutting system and at least one energy source, the energy source comprising a rotary ultrasonic horn or rotary sonotrode, wherein the first machine is configured to heat the thermoplastic substrate to a flowable state and embed at least a portion of a filament or a filament mesh within a layer of the thermoplastic substrate material such that said portion of said filament or said filament mesh is flush with a top surface of the layer and a portion of the thermoplastic substrate material in the flowable state is displaced by the portion of the filament or said filament mesh and wherein said portion of said filament or said filament mesh that displaces said substrate material does not protrude above the top surface of the layer, and wherein said filament or said filament mesh comprises a solid conductor.