Y10T 29/49163
With sintering of base
Official title: with sintering of base
Y10T29/49163 (With sintering of base) appears on 332 US grants and 246 published applications in this corpus.
Search patents in Y10T- Granted patents
- 332
- Published applications
- 246
- Assignees
- 162
- Inventors
- 716
- Latest grant
- 4 Oct 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 8 | 0 |
| 1986 | 2 | 0 |
| 1987 | 8 | 0 |
| 1988 | 5 | 0 |
| 1989 | 6 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 7 | 0 |
| 1997 | 10 | 0 |
| 1998 | 11 | 0 |
| 1999 | 10 | 0 |
| 2000 | 6 | 0 |
| 2001 | 12 | 11 |
| 2002 | 11 | 17 |
| 2003 | 12 | 22 |
| 2004 | 19 | 22 |
| 2005 | 19 | 23 |
| 2006 | 16 | 20 |
| 2007 | 18 | 15 |
| 2008 | 21 | 38 |
| 2009 | 9 | 11 |
| 2010 | 15 | 22 |
| 2011 | 19 | 9 |
| 2012 | 22 | 9 |
| 2013 | 10 | 1 |
| 2014 | 8 | 6 |
| 2015 | 11 | 12 |
| 2016 | 4 | 1 |
| 2017 | 4 | 0 |
| 2018 | 1 | 5 |
| 2019 | 2 | 0 |
| 2020 | 3 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- System producing a conductive path on a substrate4 Oct 2022US 11,464,114 B2Orbotech Ltd.
- Circuit board and production method therefor22 Sep 2020US 10,785,879 B2Ngk Spark Plug Co., Ltd.
- Method for producing ceramic multi-layer components16 Jun 2020US 10,686,120 B2Epcos AG
- Method producing a conductive path on a substrate14 Jan 2020US 10,537,027 B2Orbotech Ltd.
- Ceramic substrate31 Dec 2019US 10,524,365 B2Ngk Spark Plug Co., Ltd.
- System Producing a Conductive Path on a Substrate24 Jun 2021US 2021/0195756 A1Orbotech Ltd.
- Method producing a conductive path on a substrate19 Mar 2020US 2020/0093001 A1Orbotech Ltd.
- Circuit board and production method therefor8 Nov 2018US 2018/0324957 A1Ngk Spark Plug Co., Ltd.
- Ceramic substrate and method of manufacturing the same1 Feb 2018US 2018/0035537 A1Ngk Spark Plug Co., Ltd.
- Circuit board and production method therefor1 Feb 2018US 2018/0035549 A1Ngk Spark Plug Co., Ltd.
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Method of forming a multilayer electronic packaging substrate with integral cooling channels143US 5,870,823 AInternational Business Machines Corporation · 1999
- Method for fabricating multilayer circuits128US 4,806,188 AE. I. Du Pont de Nemours and Company · 1989
- Process for fabricating dimensionally stable interconnect boards110US 4,645,552 AHughes Aircraft Company · 1987
- Method and apparatus for providing hermetic electrical feedthrough98US 7,480,988 B2Second Sight Medical Products, Inc. · 2009