Method producing a conductive path on a substrate
AssigneeOrbotech Ltd.
InventorsZvi Kotler, Michael Zenou
Life of this patent
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Abstract
A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.
Claims12
A method of producing a conductive path on a substrate comprising:
- depositing on said substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers;
- employing a patterning laser beam to selectably sinter regions of said layer of material, thereby causing said metal particles to together define a conductor at sintered regions;
- and
- removing portions of said layer of material other than at said sintered regions.
A system for producing a conductive path on a substrate comprising:
- an optical assembly including:
- a patterning laser, operative to generate a patterning laser beam;
- and
- an ablating laser, operative to generate an ablating laser beam;
- and
- a substrate positioning assembly, movable relative to said optical assembly, operative to position said optical assembly relative to a substrate,
- said patterning laser beam being operative to selectably sinter regions of a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, deposited on said substrate, thereby causing said metal particles to together define a conductor at sintered regions;
- and
- said ablating laser beam, being operative, below a threshold at which said sintered regions would be ablated, to ablate portions of said layer of material other than at said sintered regions.
Dependencies are inferred from the claim text.