Circuit board and production method therefor
AssigneeNgk Spark Plug Co., Ltd.
InventorsTatsuya KATOH, Masanori ITO, Masaki KUTSUNA
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.
Claims8
A method of manufacturing a circuit substrate including a ceramic substrate having a surface mainly formed of a ceramic, a conductor trace formed on the surface of the ceramic substrate and mainly formed of silver (Ag), and a coating layer which contains a glass component and which is formed on the surface of the ceramic substrate and covers the conductor trace, comprising:
- a step of firing the ceramic substrate;
- a step of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag);
- a step of applying the conductor paste to the surface of the fired ceramic substrate;
- a step of applying a glass paste to the surface of the ceramic substrate after applying the conductor paste;
- a step of firing the conductor paste applied to the surface so as to form the conductor trace;
- and
- a step of firing the glass paste applied to the surface so as to form the coating layer.
A circuit substrate comprising:
- a ceramic substrate having a surface mainly formed of a ceramic;
- a conductor trace which is formed on the surface of the ceramic substrate and which is mainly formed of silver (Ag);
- and
- a coating layer which contains a glass component and which is formed on the surface of the ceramic substrate and covers the conductor trace,
- wherein in a region located adjacent to the conductor trace, the concentration of either silicon atoms (Si) or boron atoms (B) contained in the coating layer increases toward the conductor trace.
Dependencies are inferred from the claim text.