Method of forming a multilayer electronic packaging substrate with integral cooling channels
AssigneeInternational Business Machines Corporation
InventorsRaschid J. Bezama, Jon A. Casey, John B. Pavelka, Glenn A. Pomerantz
Life of this patent
Estimating the term…
Abstract
Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.
Claims18
A method of forming a multilayer ceramic substrate having one or more cooling channels, the method comprising the steps of:
- a. obtaining a plurality of ceramic greensheets, at least two of which are particularly designed for a first portion of a substrate and at least two of which are particularly designed for a second portion of a substrate, wherein at least one of the plurality of greensheets has wiring metallization thereon;
- b. laminating the ceramic greensheets which are particularly designed for the first portion of the substrate to form a first laminate;
- c. laminating the ceramic greensheets which are particularly designed for the second portion of the substrate to form a second laminate, wherein at least one of the first and second laminates contains the at least one greensheet having wiring metallization, the at least one greensheet having wiring metallization being situated within the at least one of the first and second laminates so that when the at least one of the first and second laminates is subsequently machined to form at least one cooling channel, the wiring metallization will not be machined nor will the wiring metallization be exposed to the at least one cooling channel;
- d. machining at least one cooling channel in at least one of the first and second laminates;
- e. combining the first laminate and the second laminate together to form an unsintered substrate wherein the at least one cooling channel is internal to the unsintered substrate and the wiring metallization is separate from the at least one cooling channel;
- and
- f. sintering the unsintered substrate to form a multilayer ceramic substrate having at least one cooling channel for cooling at least one heat-generating electronic device and having at least one layer of wiring metallization.
A method of forming a multilayer ceramic substrate having one or more cooling channels, the method comprising the steps of:
- a. obtaining a plurality of ceramic greensheets, at least two of which are particularly designed to be internal to the substrate and have perforated areas, at least two of which have no perforated areas, wherein at least one of the plurality of ceramic greensheets has wiring metallization thereon, the wiring metallization being designed so as to be spaced from the perforated areas;
- b. laminating the plurality of ceramic greensheets at a pressure of 500 psi or less to form an unsintered substrate wherein the perforated areas of the internal ceramic greensheets form at least one cooling channel internal to the unsintered substrate and the wiring metallization on at least one of the plurality of ceramic greensheets is spaced from the at least one cooling channel;
- and
- c. sintering the unsintered substrate to form a multilayer ceramic substrate having at least one cooling channel for cooling at least one heat-generating electronic device and having at least one layer of wiring metallization.
Dependencies are inferred from the claim text.