Circuit board and production method therefor
AssigneeNgk Spark Plug Co., Ltd.
InventorsTatsuya KATOH, Masanori ITO, Masaki KUTSUNA
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.
Claims7
A method of manufacturing a circuit substrate including a ceramic substrate having a surface mainly formed of a ceramic, a conductor trace formed on the surface of the ceramic substrate and mainly formed of silver (Ag), and a coating layer which contains a glass component and which is formed on the surface of the ceramic substrate and covers the conductor trace, comprising:
- a step of firing the ceramic substrate;
- a step of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag);
- a step of applying the conductor paste to the surface of the fired ceramic substrate;
- a step of applying a glass paste to the surface of the ceramic substrate after applying the conductor paste;
- a step of firing the conductor paste applied to the surface so as to form the conductor trace;
- and
- a step of firing the glass paste applied to the surface so as to form the coating layer.
Dependencies are inferred from the claim text.