System producing a conductive path on a substrate

A system for producing a conductive path on a substrate comprising:

• an optical assembly including:
• a patterning laser, operative to generate a patterning laser beam;
• and
• an ablating laser, operative to generate an ablating laser beam;
• and
• a substrate positioning assembly, movable relative to said optical assembly, operative to position said optical assembly relative to a substrate,
• a camera in electronic communication with a workstation, wherein said workstation is configured to:
• identify a cut between two ends of said conductive path,
• send instructions to deposit a layer of material such that said layer of material is in contact with said two ends of said conductive path, and
• send instructions to selectably sinter regions of said layer of material thereby causing said metal particles to together define a conductor at sintered regions between said two ends of said conductive path,
• said patterning laser beam being operative to selectably sinter regions of said layer of material having a thickness in a range of 0.1 to 5 microns, including metal particles having a diameter in a range of 10 to 100 nanometers, deposited on said substrate, thereby causing said metal particles to together define a conductor at sintered regions;
• and
• said ablating laser beam, being operative to deposit said layer of material and, below a threshold at which said sintered regions would be ablated, to ablate portions of said layer of material other than at said sintered regions.