Y10T 29/49144
By metal fusion
Official title: by metal fusion
Y10T29/49144 (By metal fusion) appears on 3,051 US grants and 1,915 published applications in this corpus.
Search patents in Y10T- Granted patents
- 3,051
- Published applications
- 1,915
- Assignees
- 918
- Inventors
- 4,621
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 12 | 0 |
| 1981 | 6 | 0 |
| 1982 | 12 | 0 |
| 1983 | 16 | 0 |
| 1984 | 18 | 0 |
| 1985 | 17 | 0 |
| 1986 | 19 | 0 |
| 1987 | 34 | 0 |
| 1988 | 30 | 0 |
| 1989 | 43 | 0 |
| 1990 | 41 | 0 |
| 1991 | 43 | 0 |
| 1992 | 45 | 0 |
| 1993 | 55 | 0 |
| 1994 | 60 | 0 |
| 1995 | 63 | 0 |
| 1996 | 75 | 0 |
| 1997 | 86 | 0 |
| 1998 | 107 | 0 |
| 1999 | 101 | 0 |
| 2000 | 128 | 0 |
| 2001 | 166 | 92 |
| 2002 | 157 | 204 |
| 2003 | 173 | 190 |
| 2004 | 159 | 201 |
| 2005 | 152 | 149 |
| 2006 | 158 | 122 |
| 2007 | 136 | 125 |
| 2008 | 81 | 128 |
| 2009 | 100 | 138 |
| 2010 | 128 | 136 |
| 2011 | 119 | 109 |
| 2012 | 115 | 102 |
| 2013 | 111 | 60 |
| 2014 | 85 | 55 |
| 2015 | 66 | 50 |
| 2016 | 33 | 10 |
| 2017 | 28 | 14 |
| 2018 | 25 | 6 |
| 2019 | 8 | 7 |
| 2020 | 10 | 2 |
| 2021 | 9 | 6 |
| 2022 | 2 | 4 |
| 2023 | 6 | 3 |
| 2024 | 4 | 2 |
| 2025 | 0 | 0 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Panel-molded electronic assemblies21 Apr 2026US 12,610,471 B2Vicor Corporation
- Panel-molded electronic assemblies31 Mar 2026US 12,593,411 B1Vicor Corporation
- Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices12 Nov 2024US 12,142,594 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chip-transferring system and chip-transferring method22 Oct 2024US 12,125,719 B2Skilleux Electricity Inc.
- Solderless interconnection structure and method of forming same16 Apr 2024US 11,961,810 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices28 Nov 2024US 2024/0395767 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Stacked microfeature devices and associated methods9 May 2024US 2024/0153917 A1Micron Technology, Inc.
- Electronic module13 Jul 2023US 2023/0225055 A1Imberatek, LLC
- Conductor bonding method29 Jun 2023US 2023/0209724 A1
- Stacked microfeature devices and associated methods12 Jan 2023US 2023/0008716 A1Micron Technology, Inc.
Most cited
By later US patents
- LED lamp manufacturing method1,017US 8,210,721 B2Everlight Electronics Co., Ltd. · 2012
- Method for fabricating an integrated circuit module849US 5,353,498 AGeneral Electric Company · 1994
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Three-dimensional multi-chip pad array carrier602US 5,222,014 AMotorola, Inc. · 1993
- Alumina insulation for coating implantable components and other microminiature devices490US 6,043,437 AAlfred E. Mann Foundation · 2000