Electronic module

An electronic module, comprising:

• a first conductive-pattern layer and a second conductive-pattern layer disposed on the first conductive-pattern layer, the second conductive-pattern layer having a first surface;
• an insulating-material layer disposed on the first surface of the second conductive-pattern layer;
• a component disposed inside the insulating-material layer, the component comprising contact zones comprising aluminum;
• first contact bumps disposed on the first surface of the second conductive-pattern layer and electrically connected thereto;
• and
• second contact bumps disposed on the contact zones and electrically connected thereto, wherein:
• at least one of the first contact bumps and the second contact bumps are electronically connected;
• the second contact bumps comprise at least two layers of at least two different materials;
• and
• a material of the first contact bumps is different from the at least two different materials of the second contact bumps and the material of the second conductive-pattern layer.