Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu
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Abstract
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.
Claims20
A method of processing a semiconductor device, the method comprising:
- attaching a plurality of first package components to a support, each of the plurality of first package components separated by scribe lines and comprising a substrate with contact pads formed thereon;
- disposing a tool over the scribe lines, the tool comprising a first material and a second material, the second material disposed on a surface of the tool facing away from the support, the second material having a higher reflectivity to radiation energy at a predetermined wavelength range than the first material, the tool further comprising a plurality of apertures, each of the plurality of first package components being within a respective one of the plurality of apertures;
- disposing a plurality of second package components over the plurality of first package components, each of the plurality of second package components being within a respective one of the plurality of apertures;
- exposing the tool and the plurality of second package components to radiation energy;
- removing the tool from the plurality of first package components;
- removing the plurality of first package components from the support;
- and
- cutting the plurality of first package components along the scribe lines.
A method of processing a semiconductor device, the method comprising:
- placing a support structure on a conveyor belt;
- placing a first package component onto the support structure;
- placing a first material attached to a second material over the first package component, the second material having a higher reflectivity to a first wavelength of light than the first material;
- placing a second package component into an aperture of the first material and in physical contact with the first package component;
- reflecting light with the first wavelength off of the second material;
- and
- singulating the first package component after the reflecting the light.
A method of processing a semiconductor device, the method comprising:
- attaching a plurality of first package components to a support structure, the first package components being separated by scribe lines;
- positioning a tool over the first package components, the tool comprising:
- a first material,
- a second material disposed on a surface of the first material facing away from the support structure, the second material having a higher reflectivity to radiation energy at a predetermined wavelength range than the first material, and
- a plurality of apertures;
- placing a plurality of second package components within the apertures of the tool and over the first package components;
- exposing the tool and the second package components to radiation energy;
- reflecting a portion of the radiation energy off of the second material;
- removing the tool from the first package components;
- and
- singulating the first package components along the scribe lines.
Dependencies are inferred from the claim text.