Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuei-Wei Huang, Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu
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Abstract
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.
Claims19
A method of processing a semiconductor device, the method comprising:
- attaching a first package component to a support, the first package component comprising a substrate with contact pads formed thereon;
- disposing a tool over the first package component, the tool comprising an aperture configured to enclose the first package component, the tool comprising a reflective first surface most distal from the support, wherein the reflective first surface reflects radiation energy with a first wavelength, wherein the reflective first surface of the tool has a higher reflectivity to the radiation energy than a second surface opposite the first surface of the tool and the reflective first surface of the tool has a higher reflectivity to infrared (IR) energy at a different wavelength than the radiation energy than the second surface of the tool;
- placing a second package component over the first package component within the aperture of the tool;
- and
- exposing the tool and the second package component to the radiation energy.
A method of processing a semiconductor device, the method comprising:
- attaching a first package component to a support, the first package component comprising a substrate with contact pads formed thereon;
- disposing a tool over the first package component, the tool comprising an aperture configured to enclose the first package component, the tool comprising a reflective first surface most distal from the support;
- placing a second package component over the first package component within the aperture of the tool;
- positioning the tool and the second package component beneath a radiation energy source, wherein the radiation energy source emits radiation energy at a first wavelength, wherein the reflective first surface of the tool has a higher reflectivity to the radiation energy than a second surface opposite the first surface of the tool and the reflective first surface of the tool has a higher reflectivity to infrared (IR) energy at a different wavelength than the radiation energy than the second surface of the tool;
- and
- exposing the tool and the second package component to the radiation energy from the radiation energy source.
A method of processing a semiconductor device, the method comprising:
- attaching a first package component to a support, the first package component comprising a substrate with contact pads formed thereon;
- disposing a tool over the first package component, the tool comprising an aperture configured to enclose the first package component, the tool comprising a reflective first surface most distal from the support, wherein the reflective first surface reflects infrared (IR) energy, wherein the reflective first surface of the tool has a higher reflectivity to the IR energy than a second surface of the tool and the reflective first surface of the tool has a higher reflectivity to radiation energy than the second surface of the tool;
- tool, the second surface of the tool opposing the first surface, and the infrared energy being a different wavelength than the radiation energy;
- placing a second package component over the first package component within the aperture of the tool;
- and
- exposing the tool and the second package component to the IR energy.
Dependencies are inferred from the claim text.