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US 11,961,810 B2Granted
Solderless interconnection structure and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Wei Lin, Sheng-Yu Wu, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen
Life of this patent
Estimating the term…
Abstract
An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.
Claims20
A device comprising:
- a trace extending along a substrate by a first length, the trace having a first end mounted to the substrate and having a second end distal to the first end, the first end having a first width, the second end having a second width, the first length greater than the first width and the second width;
- and
- a chip comprising:
- an integrated circuit;
- an insulating layer on the integrated circuit;
- a contact pad in the insulating layer;
- a passivation layer on the contact pad and the insulating layer;
- a polyimide layer on the passivation layer and in physical contact with the contact pad;
- an under bump metallurgy extending through the polyimide layer and the passivation layer, the under bump metallurgy coupled to the contact pad;
- a bump having a third end mounted to the under bump metallurgy and having a fourth end distal to the third end, the third end having a third width, the fourth end having a fourth width, the fourth width less than the third width, wherein the second end of the trace is directly bonded to the fourth end of the bump, the second end of the trace and the fourth end of the bump being free of solder and of intermetallic compounds;
- and
- an oxide layer disposed on an entirety of a first sidewall of the bump, the first sidewall extending from the third end to the fourth end.
9 more elements
A device comprising:
- a metal trace extending along a major surface of a first substrate, the metal trace having a first end mounted to the first substrate and having a second end distal to the first end, the first end having a greater width than the second end;
- and
- a metal bump extending from a second substrate, the metal bump having a third end mounted to the second substrate and having a fourth end distal to the third end, the third end having a greater width than the fourth end, wherein the metal bump and the metal trace are physically and electrically coupled together through direct metal-to-metal bonds, an interface between the metal bump and the metal trace being free of solder, and wherein the metal trace has a greater length than the metal bump in a direction parallel to the major surface of the first substrate;
- and
- a first oxide layer disposed on an entirety of a sidewall of the metal bump, wherein the sidewall extends from the third end to the fourth end.
2 more elements
A device comprising:
- a metal trace mounted on a first substrate, the metal trace having a first width, the metal trace extending along a surface of the first substrate by a first length, the first length greater than the first width;
- and
- a chip comprising:
- a contact pad over a second substrate;
- an insulating layer surrounding the contact pad;
- a polyimide layer over the contact pad and the insulating layer;
- an under bump metallurgy over the polyimide layer, the contact pad, and the insulating layer;
- and
- a metal bump mounted over the second substrate and on the under bump metallurgy, the metal bump having a second width, the second width decreasing along a second direction extending from the second substrate to the first substrate, wherein the under bump metallurgy isolates the metal bump from the polyimide layer, and wherein the metal bump and the metal trace are physically and electrically coupled together without solder.
6 more elements
Dependencies are inferred from the claim text.