Y10T 29/49139
By inserting component lead or terminal into base aperture
Official title: by inserting component lead or terminal into base aperture
Y10T29/49139 (By inserting component lead or terminal into base aperture) appears on 1,025 US grants and 660 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,025
- Published applications
- 660
- Assignees
- 483
- Inventors
- 1,692
- Latest grant
- 22 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 15 | 0 |
| 1981 | 8 | 0 |
| 1982 | 8 | 0 |
| 1983 | 9 | 0 |
| 1984 | 14 | 0 |
| 1985 | 20 | 0 |
| 1986 | 19 | 0 |
| 1987 | 19 | 0 |
| 1988 | 25 | 0 |
| 1989 | 18 | 0 |
| 1990 | 14 | 0 |
| 1991 | 12 | 0 |
| 1992 | 16 | 0 |
| 1993 | 17 | 0 |
| 1994 | 23 | 0 |
| 1995 | 14 | 0 |
| 1996 | 14 | 0 |
| 1997 | 15 | 0 |
| 1998 | 27 | 0 |
| 1999 | 25 | 0 |
| 2000 | 33 | 0 |
| 2001 | 32 | 23 |
| 2002 | 29 | 48 |
| 2003 | 45 | 48 |
| 2004 | 55 | 65 |
| 2005 | 41 | 43 |
| 2006 | 59 | 56 |
| 2007 | 45 | 34 |
| 2008 | 15 | 45 |
| 2009 | 30 | 33 |
| 2010 | 39 | 47 |
| 2011 | 37 | 38 |
| 2012 | 48 | 46 |
| 2013 | 29 | 34 |
| 2014 | 44 | 47 |
| 2015 | 23 | 31 |
| 2016 | 33 | 7 |
| 2017 | 17 | 3 |
| 2018 | 7 | 3 |
| 2019 | 3 | 3 |
| 2020 | 5 | 3 |
| 2021 | 3 | 2 |
| 2022 | 1 | 0 |
| 2023 | 2 | 1 |
| 2024 | 1 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Method and apparatus for multiple input power distribution to adjacent outputs22 Oct 2024US 12,126,147 B2Legrand DPC, LLC
- Method for manufacturing an electronic module and electronic module1 Aug 2023US 11,716,816 B2Imberatek, LLC
- Method for inspecting insertion states of plurality of pins included in connector inserted into substrate, and substrate inspection apparatus3 Jan 2023US 11,547,033 B2Koh Young Technology Inc.
- Method and apparatus for multiple input power distribution to adjacent outputs19 Jul 2022US 11,394,179 B2Server Technology, Inc.
- Component mounting method and method for manufacturing component-mounted board18 May 2021US 11,013,160 B2Panasonic Intellectual Property Management Co., Ltd.
- Method and apparatus for multiple input power distribution to adjacent outputs15 Jun 2023US 2023/0187912 A1Server Technology, Inc.
- Method for manufacturing an electronic module and electronic module21 Oct 2021US 2021/0329788 A1Imberatek, LLC
- Method and apparatus for multiple input power distribution to adjacent outputs4 Feb 2021US 2021/0036494 A1Server Technology, Inc.
- Method for inspecting insertion states of plurality of pins included in connector inserted into substrate, and substrate inspection apparatus5 Nov 2020US 2020/0352069 A1Koh Young Technology Inc.
- Electronic component mounter18 Jun 2020US 2020/0196497 A1Fuji Corporation
Most cited
By later US patents
- Strip electrode including screen printing of a single layer1,163US 5,509,410 AMedisense, Inc. · 1996
- Strip electrode with screen printing524US 5,727,548 AMedisense, Inc. · 1998
- Substrate for packaging a semiconductor device370US 5,214,308 ASumitomo Electric Industries, Ltd. · 1993
- Interconnection of electronic components279US 4,955,523 ARaychem Corporation · 1990
- Flip chip image sensor package fabrication method228US 6,571,466 B1Amkor Technology, Inc. · 2003