Flip chip image sensor package fabrication method
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Steven Webster, Roy Dale Hollaway
Life of this patent
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Abstract
A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.
Claims20
A method comprising:
- forming an aperture in a substrate;
- mounting an image sensor to said substrate such that an active area of said image sensor is aligned with said aperture;
- forming a bead around a periphery of said image sensor, where an aperture side of said aperture, said image sensor, and said bead define a pocket;
- and
- filling said pocket with a liquid encapsulant.
Dependencies are inferred from the claim text.