Method for manufacturing an electronic module and electronic module

An electronic module, comprising:

• a first conductive pattern layer, and a first insulating-material layer arranged on at least one surface of the first conductive pattern layer;
• an opening in the first insulating-material layer that extends through the first insulating-material layer;
• a component comprising contact terminals, the component being arranged at least partially within the opening, the contact terminals electrically connected to the first conductive pattern layer;
• a second insulating-material layer disposed on the first insulating-material layer;
• a third insulating-material layer disposed on the second insulating-material layer;
• and
• a second conductive pattern layer spaced apart from the first conductive pattern layer by at least the first, second, and third insulating-material layers,
• wherein the first conductive pattern layer and the second conductive pattern layer are each substantially planar.