Interconnection of electronic components
AssigneeRaychem Corporation
InventorsWilliam D. Carlommagno, Dennis E. Cummings, Alexandru S. Gliga
Life of this patent
Estimating the term…
Abstract
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.
Claims14
A method of interconnecting contacts on first and second electronic components, comprising:
- (a) forming individual interconnection wires on each contact on the first component by:
- (i) bonding a wire to the contact without the use of a material other than the materials of the contact and the wire, and
- (ii) severing the wire to leave an interconnection wire bonded to the contact and having a free end, the length of the interconnection wire, measured from the contact or, if a portion of the interconnection wire is broadened in the vicinity of the contact, from a point immediately above any such broadening, being from about 2d to about 20d where d is the diameter of the wire;
- (b) positioning the components so that the second component is in face-to-face relationship with the first component;
- and
- (c) bonding the free end of each interconnection wire to a respective contact on the second component.
A method of forming an interconnection wire on a contact on an electronic component, comprising:
- (a) bonding a wire to the contact without the use of a material other than the materials of the contact and the wire, the wire being supplied through a bonding head on a wire bonder;
- (b) weakening the wire at a point within the bonding head;
- (c) severing the weakened wire to leave an interconnection wire bonded to the contact and having a free end, the length of the interconnection wire, measured from the contact or, if a portion of the interconnection wire is broadened in the vicinity of the contact, from a point immediately above any such broadening, being from about 2d to about 20d where d is the diameter of the interconnection wire.
A method of forming an interconnection wire on a contact on an electronic component, comprising:
- (a) bonding a wire to the contact without the use of a material other than the materials of the contact and the wire at a temperature below the melting points of the material of the contact and the wire;
- (b) weakening the wire at a point a desired distance from the bond to the contact so that it breaks under a force applied at the point at which it has been weakened;
- (c) applying force to the wire in a direction away from the contact thereby breaking the wire to leave an interconnection wire bonded to the contact and having a free end, the length of the interconnection wire, measured from the contact or, if a portion of the interconnection wire is broadened in the vicinity of the contact, from a point immediately above any such broadening, being from about 2d to about 20d where d is the diameter of the interconnection wire.
Dependencies are inferred from the claim text.