Component mounting method and method for manufacturing component-mounted board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTetsuya Tanaka, Masahiko Akasaka, Koji Sakurai, Toshihiko Nagaya
Life of this patent
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Abstract
There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.
Claims16
A component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, the method comprising:
- inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole;
- lowering the pin to a mounting height position for mounting the electronic component on the board;
- after lowering the pin to the mounting height position, pulling up the pin to an intermediate height position, the intermediate height position being higher than the mounting height position;
- and
- lowering the pin again to the mounting height position to improve an adhesion state of solder paste on the pin.
A component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, the method comprising:
- a printing step of printing solder paste on the board;
- a mounting step of mounting the electronic component on the board on which the solder paste is printed;
- and
- a reflow step of melting and solidifying solder in the solder paste by heating the board on which the electronic component is mounted, to solder-bond the electronic component to the board,
- wherein, in the mounting step, the pin of the electronic component is inserted into an inner hole filled with solder paste at a first electrode provided in the through-hole and lowered to a mounting height position, and the pin once inserted and lowered into the inner hole in the component mounting operation is pulled up to a intermediate height position which is higher than the mounting height position, and then lowered again to the mounting height position to improve an adhesion state of solder paste on the pin, and
- in the reflow step, the pin is solder-bonded to the first electrode by reflowing the board on which the component mounting operation has been completed.
A method for manufacturing a component-mounted board by mounting an electronic component provided with a connecting pin on a board having a through-hole, the method comprising:
- inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole;
- lowering the pin to a mounting height position;
- pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to an intermediate height position, the intermediate height position being higher than the mounting height position;
- and
- lowering the pin again to improve a wet adhesion state of solder paste on the pin.
A method for manufacturing a component-mounted board by mounting an electronic component provided with a connecting pin on a board having a through-hole, the method comprising:
- a printing step of printing solder paste on the board;
- a mounting step of mounting the electronic component on the board on which the solder paste is printed;
- and
- a reflow step of melting and solidifying the solder in the solder paste by heating the board on which the electronic component is mounted, to solder-bond the electronic component to the board,
- wherein, in the mounting step, the pin of the electronic component is inserted into an inner hole filled with solder paste at a first electrode provided in the through-hole and lowered to a mounting height position, and the pin once inserted and lowered into the inner hole in the component mounting operation is pulled up to an intermediate height position, the intermediate height position being higher than the mounting height position, and then lowered again to improve a wet adhesion state of solder paste on the pin, and
- in the reflow step, the pin is solder-bonded to the first electrode by reflowing the board on which the component mounting operation has been completed.
Dependencies are inferred from the claim text.