Y10T 156/1153
Temperature change for delamination [e.g., heating during delaminating, etc.]
Y10T156/1153 (Temperature change for delamination [e.g., heating during delaminating, etc.]) appears on 536 US grants and 479 published applications in this corpus.
Search patents in Y10T- Granted patents
- 536
- Published applications
- 479
- Assignees
- 323
- Inventors
- 1,186
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 7 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 13 | 0 |
| 2000 | 23 | 0 |
| 2001 | 12 | 3 |
| 2002 | 11 | 15 |
| 2003 | 17 | 8 |
| 2004 | 8 | 7 |
| 2005 | 9 | 16 |
| 2006 | 3 | 13 |
| 2007 | 8 | 14 |
| 2008 | 9 | 21 |
| 2009 | 7 | 26 |
| 2010 | 13 | 38 |
| 2011 | 19 | 32 |
| 2012 | 24 | 23 |
| 2013 | 24 | 44 |
| 2014 | 42 | 38 |
| 2015 | 25 | 38 |
| 2016 | 25 | 26 |
| 2017 | 28 | 20 |
| 2018 | 34 | 17 |
| 2019 | 31 | 25 |
| 2020 | 12 | 19 |
| 2021 | 21 | 11 |
| 2022 | 12 | 6 |
| 2023 | 10 | 9 |
| 2024 | 10 | 6 |
| 2025 | 6 | 3 |
| 2026 | 4 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Thermal decomposition apparatus and thermal decomposition method applying the same23 Jun 2026US 12,666,749 B2Industrial Technology Research Institute
- Dynamic release tapes for assembly of discrete components10 Feb 2026US 12,550,675 B2Kulicke & Soffa Netherlands B.V.
- Automated dismantling and separation system for solar panels27 Jan 2026US 12,533,874 B2
- Automated pharmaceutical bottle information removal apparatus13 Jan 2026US 12,521,774 B1Tangent Design LLC
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same7 Oct 2025US 12,438,014 B2Samsung Electronics Co., Ltd.
- Substrate debonding system including light irradiation apparatus8 Jan 2026US 2026/0011581 A1Samsung Electronics Co., Ltd.
- Glass cover disassembly equipment and glass cover disassembly method using the same7 Aug 2025US 2025/0249676 A1Industrial Technology Research Institute
- Automated dismantling and separation system for solar panels5 Jun 2025US 2025/0178333 A1Glotern Green Energy Co., Ltd.
- Plate cooling device and de-bonding station with plate cooling device27 Mar 2025US 2025/0100267 A1Sky Tech Inc.
- Heat stamp and method for releasing protective tape using heat stamp26 Sep 2024US 2024/0321606 A1Kabushiki Kaisha Toshiba
Most cited
By later US patents
- Methods for forming nanofiber adhesive structures538US 7,479,198 B22009
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Controlled cleaving process280US 7,371,660 B2Silicon Genesis Corporation · 2008
- Method of transferring a micro device250US 8,333,860 B1LuxVue Technology Corporation · 2012