Y10T 156/1158
Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
Y10T156/1158 (Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]) appears on 277 US grants and 252 published applications in this corpus.
Search patents in Y10T- Granted patents
- 277
- Published applications
- 252
- Assignees
- 179
- Inventors
- 613
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 16 | 0 |
| 2001 | 8 | 1 |
| 2002 | 8 | 11 |
| 2003 | 15 | 6 |
| 2004 | 4 | 4 |
| 2005 | 4 | 6 |
| 2006 | 1 | 7 |
| 2007 | 4 | 8 |
| 2008 | 6 | 7 |
| 2009 | 5 | 17 |
| 2010 | 8 | 20 |
| 2011 | 12 | 22 |
| 2012 | 7 | 10 |
| 2013 | 9 | 15 |
| 2014 | 17 | 17 |
| 2015 | 15 | 19 |
| 2016 | 14 | 16 |
| 2017 | 12 | 15 |
| 2018 | 21 | 7 |
| 2019 | 17 | 15 |
| 2020 | 5 | 9 |
| 2021 | 11 | 7 |
| 2022 | 9 | 5 |
| 2023 | 7 | 5 |
| 2024 | 6 | 2 |
| 2025 | 4 | 0 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Dynamic release tapes for assembly of discrete components10 Feb 2026US 12,550,675 B2Kulicke & Soffa Netherlands B.V.
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same7 Oct 2025US 12,438,014 B2Samsung Electronics Co., Ltd.
- Separating system and separating method23 Sep 2025US 12,424,461 B2Tokyo Electron Limited
- Peeling method25 Mar 2025US 12,258,499 B2Nitto Denko Corporation
- Dynamic release tapes for assembly of discrete components28 Jan 2025US 12,211,730 B2Kulicke & Soffa Netherlands B.V.
- Substrate debonding system including light irradiation apparatus8 Jan 2026US 2026/0011581 A1Samsung Electronics Co., Ltd.
- Method, holder and adapter for treating microchip substrates9 May 2024US 2024/0150923 A1MTI, Inc.
- Light irradiation apparatus, substrate debonding system including the same, and subtrated debonding method using the same14 Mar 2024US 2024/0087921 A1Samsung Electronics Co., Ltd.
- Peeling method7 Dec 2023US 2023/0392044 A1Nitto Denko Corporation
- Manufacturing apparatus of semiconductor device2 Nov 2023US 2023/0352324 A1Kabushiki Kaisha Shinkawa
Most cited
By later US patents
- Methods for forming nanofiber adhesive structures538US 7,479,198 B22009
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Controlled cleaving process280US 7,371,660 B2Silicon Genesis Corporation · 2008
- Controlled cleaning process180US 6,013,563 ASilicon Genesis Corporation · 2000