Y10T 156/11
Methods of delaminating, per se
Official title: Methods of delaminating, per se; i.e. , separating at bonding face
Y10T156/11 (Methods of delaminating, per se) appears on 2,465 US grants and 1,985 published applications in this corpus.
Search patents in Y10T- Granted patents
- 2,465
- Published applications
- 1,985
- Assignees
- 1,125
- Inventors
- 4,673
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 17 | 0 |
| 1977 | 13 | 0 |
| 1978 | 15 | 0 |
| 1979 | 9 | 0 |
| 1980 | 15 | 0 |
| 1981 | 26 | 0 |
| 1982 | 15 | 0 |
| 1983 | 24 | 0 |
| 1984 | 25 | 0 |
| 1985 | 17 | 0 |
| 1986 | 17 | 0 |
| 1987 | 26 | 0 |
| 1988 | 23 | 0 |
| 1989 | 35 | 0 |
| 1990 | 36 | 0 |
| 1991 | 20 | 0 |
| 1992 | 33 | 0 |
| 1993 | 30 | 0 |
| 1994 | 39 | 0 |
| 1995 | 57 | 0 |
| 1996 | 36 | 0 |
| 1997 | 34 | 0 |
| 1998 | 41 | 0 |
| 1999 | 54 | 0 |
| 2000 | 65 | 0 |
| 2001 | 55 | 17 |
| 2002 | 52 | 76 |
| 2003 | 64 | 82 |
| 2004 | 61 | 76 |
| 2005 | 52 | 83 |
| 2006 | 36 | 72 |
| 2007 | 53 | 82 |
| 2008 | 50 | 102 |
| 2009 | 44 | 112 |
| 2010 | 87 | 113 |
| 2011 | 75 | 110 |
| 2012 | 103 | 115 |
| 2013 | 113 | 137 |
| 2014 | 124 | 157 |
| 2015 | 100 | 147 |
| 2016 | 118 | 83 |
| 2017 | 96 | 65 |
| 2018 | 102 | 78 |
| 2019 | 91 | 61 |
| 2020 | 52 | 58 |
| 2021 | 50 | 44 |
| 2022 | 56 | 29 |
| 2023 | 37 | 41 |
| 2024 | 35 | 22 |
| 2025 | 21 | 15 |
| 2026 | 16 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- Y10T 156/1168Gripping and pulling work apart during delaminating1,214
- Y10T 156/1153Temperature change for delamination [e.g., heating during delaminating, etc.]536
- Y10T 156/1126Using direct fluid current against work during delaminating388
- Y10T 156/1111Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during268
- Y10T 156/1142Changing dimension during delaminating [e.g., crushing, expanding, warping, etc.]128
- Y10T 156/1105Delaminating process responsive to feed or shape at delamination113
- Y10T 156/1121Using vibration during delaminating49
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Thermal decomposition apparatus and thermal decomposition method applying the same23 Jun 2026US 12,666,749 B2Industrial Technology Research Institute
- Device and method for peeling off protective films from plate-shaped objects26 May 2026US 12,636,873 B2Advanced Engineering Industrie Automation GmbH
- Systems and methods for managing surgical sponges19 May 2026US 12,629,228 B2Stryker Corporation
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate processing apparatus and substrate processing method13 Aug 2026US 2026/0239913 A1Tokyo Electron Limited
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Binder composition for secondary battery23 Jul 2026US 2026/0208476 A1Grst Singapore Pte. Ltd.
Most cited
By later US patents
- Staple supporting and removing strip1,414US 4,409,057 AMinnesota Mining and Manufacturing Company · 1983
- Methods for forming nanofiber adhesive structures538US 7,479,198 B22009
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011