Y10T 156/1111
Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during
Official title: Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during delamination, etc.]
Y10T156/1111 (Using solvent during delaminating [e.g., water dissolving adhesive at bonding face during) appears on 268 US grants and 255 published applications in this corpus.
Search patents in Y10T- Granted patents
- 268
- Published applications
- 255
- Assignees
- 170
- Inventors
- 532
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 9 | 0 |
| 2001 | 2 | 0 |
| 2002 | 9 | 5 |
| 2003 | 3 | 6 |
| 2004 | 7 | 8 |
| 2005 | 3 | 4 |
| 2006 | 2 | 4 |
| 2007 | 2 | 8 |
| 2008 | 6 | 7 |
| 2009 | 3 | 18 |
| 2010 | 8 | 18 |
| 2011 | 7 | 12 |
| 2012 | 11 | 14 |
| 2013 | 14 | 26 |
| 2014 | 20 | 22 |
| 2015 | 18 | 24 |
| 2016 | 19 | 12 |
| 2017 | 12 | 11 |
| 2018 | 15 | 9 |
| 2019 | 13 | 12 |
| 2020 | 4 | 9 |
| 2021 | 12 | 7 |
| 2022 | 10 | 6 |
| 2023 | 6 | 11 |
| 2024 | 6 | 1 |
| 2025 | 3 | 0 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Binder composition for secondary battery21 Apr 2026US 12,605,926 B2Grst Singapore Pte. Ltd.
- Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peeling27 Jan 2026US 12,534,693 B2Nissan Chemical Corporation
- Method for composite delamination15 Jul 2025US 12,358,275 B2Grst Singapore Pte. Ltd.
- Method for composite delamination27 May 2025US 12,311,648 B2Grst Singapore Pte. Ltd.
- Method for composite delamination7 Jan 2025US 12,187,021 B2GRST International Limited
- Binder composition for secondary battery23 Jul 2026US 2026/0208476 A1Grst Singapore Pte. Ltd.
- Peeling device and peeling method using the same4 Jan 2024US 2024/0001665 A1Samsung Display Co., Ltd.
- Method for composite delamination26 Oct 2023US 2023/0340379 A1GRST International Limited
- Cathode active material, cathode slurry and cathode for secondary battery13 Jul 2023US 2023/0223517 A1GRST International Limited
- Binder composition for secondary battery6 Jul 2023US 2023/0216055 A1GRST International Limited
Most cited
By later US patents
- Synthesis of layers, coatings or films using precursor layer exerted pressure containment87US 6,500,733 B1HelioVolt Corporation · 2002
- Method of making absorbent bearing products77US 4,415,388 AJohnson & Johnson · 1983
- Apparatus for producing semiconductor wafers65US 5,447,596 AMitsubishi Denki Kabushiki Kaisha · 1995
- Electrolytic cell membrane/SPE formation by solution coating63US 4,386,987 ADiamond Shamrock Corporation · 1983
- Layers, coatings or films synthesized using precursor layer exerted pressure containment55US 6,797,874 B2HelioVolt Corporation · 2004