Y10T 156/1168
Gripping and pulling work apart during delaminating
Y10T156/1168 (Gripping and pulling work apart during delaminating) appears on 1,214 US grants and 986 published applications in this corpus.
Search patents in Y10T- Granted patents
- 1,214
- Published applications
- 986
- Assignees
- 631
- Inventors
- 2,301
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 5 | 0 |
| 1979 | 4 | 0 |
| 1980 | 6 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 8 | 0 |
| 1984 | 9 | 0 |
| 1985 | 7 | 0 |
| 1986 | 7 | 0 |
| 1987 | 10 | 0 |
| 1988 | 7 | 0 |
| 1989 | 15 | 0 |
| 1990 | 17 | 0 |
| 1991 | 9 | 0 |
| 1992 | 11 | 0 |
| 1993 | 15 | 0 |
| 1994 | 17 | 0 |
| 1995 | 24 | 0 |
| 1996 | 20 | 0 |
| 1997 | 23 | 0 |
| 1998 | 22 | 0 |
| 1999 | 27 | 0 |
| 2000 | 22 | 0 |
| 2001 | 22 | 9 |
| 2002 | 18 | 34 |
| 2003 | 27 | 41 |
| 2004 | 25 | 41 |
| 2005 | 26 | 31 |
| 2006 | 19 | 37 |
| 2007 | 26 | 43 |
| 2008 | 22 | 46 |
| 2009 | 15 | 52 |
| 2010 | 54 | 62 |
| 2011 | 35 | 41 |
| 2012 | 54 | 52 |
| 2013 | 52 | 59 |
| 2014 | 63 | 68 |
| 2015 | 54 | 83 |
| 2016 | 74 | 46 |
| 2017 | 55 | 36 |
| 2018 | 61 | 52 |
| 2019 | 50 | 32 |
| 2020 | 34 | 30 |
| 2021 | 28 | 26 |
| 2022 | 32 | 15 |
| 2023 | 18 | 20 |
| 2024 | 22 | 15 |
| 2025 | 10 | 10 |
| 2026 | 8 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Device and method for peeling off protective films from plate-shaped objects26 May 2026US 12,636,873 B2Advanced Engineering Industrie Automation GmbH
- Systems and methods for managing surgical sponges19 May 2026US 12,629,228 B2Stryker Corporation
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Delamination of used solar module16 Jul 2026US 2026/0200225 A1SOLARCYCLE, Inc.
- Method of preparing a bonding surface on a composite laminate and associated composite laminate19 Mar 2026US 2026/0077564 A1The Boeing Company
Most cited
By later US patents
- Staple supporting and removing strip1,414US 4,409,057 AMinnesota Mining and Manufacturing Company · 1983
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011
- Apparatus and method for the non-destructive separation of hardened material layers from a flat construction plane319US 7,438,846 B2Envisiontec GmbH · 2008
- Release strategies for making transferable semiconductor structures, devices and device components208US 8,895,406 B2The Board of Trustees of the University of Illinois · 2014
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003