Y10T 156/1179
With poking during delaminating [e.g., jabbing, etc.]
Official title: with poking during delaminating [e.g., jabbing, etc.]
Y10T156/1179 (With poking during delaminating [e.g., jabbing, etc.]) appears on 422 US grants and 358 published applications in this corpus.
Search patents in Y10T- Granted patents
- 422
- Published applications
- 358
- Assignees
- 243
- Inventors
- 783
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 7 | 0 |
| 1995 | 11 | 0 |
| 1996 | 8 | 0 |
| 1997 | 6 | 0 |
| 1998 | 6 | 0 |
| 1999 | 7 | 0 |
| 2000 | 5 | 0 |
| 2001 | 9 | 4 |
| 2002 | 6 | 17 |
| 2003 | 14 | 20 |
| 2004 | 12 | 15 |
| 2005 | 9 | 17 |
| 2006 | 7 | 15 |
| 2007 | 16 | 11 |
| 2008 | 10 | 12 |
| 2009 | 5 | 19 |
| 2010 | 18 | 17 |
| 2011 | 8 | 13 |
| 2012 | 17 | 15 |
| 2013 | 18 | 18 |
| 2014 | 17 | 26 |
| 2015 | 21 | 26 |
| 2016 | 35 | 25 |
| 2017 | 20 | 14 |
| 2018 | 20 | 16 |
| 2019 | 18 | 12 |
| 2020 | 14 | 14 |
| 2021 | 15 | 9 |
| 2022 | 10 | 7 |
| 2023 | 5 | 4 |
| 2024 | 9 | 3 |
| 2025 | 2 | 5 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method7 Apr 2026US 12,598,939 B2SCREEN Holdings Co., Ltd.
- Prepreg composite material ply and backing separation systems and methods31 Mar 2026US 12,589,585 B2Accudyne Systems, Inc.
- Delamination of used solar module17 Mar 2026US 12,576,631 B1SOLARCYCLE, Inc.
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Delamination of used solar module16 Jul 2026US 2026/0200225 A1SOLARCYCLE, Inc.
- Prepreg composite material ply and backing separation systems and methods4 Sep 2025US 2025/0276510 A1Accudyne Systems, Inc.
Most cited
By later US patents
- Method and system for mounting semiconductor device, semiconductor device separating system, and method for fabricating IC card175US 6,629,553 B2Hitachi, Ltd. · 2003
- Strippalble sponge cushion underlay for a surface covering, such as carpeting109US 4,824,498 AJames River Corporation · 1989
- Mold release layer transferring film and laminate film88US 7,255,919 B2Mitsui Mining & Smelting Co., Ltd. · 2007
- Method of producing semiconductor thin film and method of producing solar cell using same69US 6,802,926 B2Canon Kabushiki Kaisha · 2004
- Method and product for floor covering installation and removal67US 5,116,439 ASponge-Cushion, Inc. · 1992