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US 7,255,919 B2Granted
Mold release layer transferring film and laminate film
AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKen Sakata, Katsuhiko Hayashi
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AssigneeMitsui Mining & Smelting Co., Ltd.
InventorsKen Sakata, Katsuhiko Hayashi
Estimating the term…
Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line. The releasing layer transfer film 1 for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate 2 and a transferable releasing layer 3 provided on a surface of the transfer film substrate 2, wherein the transferable releasing layer 3 is formed from a releasing agent and can be transferred onto the insulating layer.
A releasing layer transfer film for forming a releasing layer onto an insulating layer serving as a component of a chip-on-film flexible printed wiring board, characterized in that the releasing layer transfer film comprises a transfer film substrate, and a transferable releasing layer provided on a surface of the transfer film substrate, wherein the transferable releasing layer is formed from a releasing agent comprising a silazane compound and can be transferred onto the insulating layer.
A laminate film, comprising a film substrate, a releasing layer provided on a surface of the film substrate, an insulating layer provided on the surface of the releasing layer opposite the side of the film substrate, and a conductor layer provided on the surface of the insulating layer opposite the side of the releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound, a silica sol and a silazane compound, and the insulating layer serves as a member of a COF flexible printed wiring board.
A method for producing a COF flexible printed wiring board, the method comprising
Dependencies are inferred from the claim text.