Y10T 156/1174
Using roller for delamination [e.g., roller pairs operating at differing speeds or
Official title: Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
Y10T156/1174 (Using roller for delamination [e.g., roller pairs operating at differing speeds or) appears on 215 US grants and 187 published applications in this corpus.
Search patents in Y10T- Granted patents
- 215
- Published applications
- 187
- Assignees
- 139
- Inventors
- 409
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 1 |
| 2002 | 3 | 8 |
| 2003 | 5 | 5 |
| 2004 | 6 | 2 |
| 2005 | 4 | 1 |
| 2006 | 2 | 5 |
| 2007 | 0 | 10 |
| 2008 | 4 | 7 |
| 2009 | 1 | 13 |
| 2010 | 7 | 6 |
| 2011 | 10 | 10 |
| 2012 | 14 | 12 |
| 2013 | 12 | 9 |
| 2014 | 12 | 11 |
| 2015 | 12 | 13 |
| 2016 | 17 | 16 |
| 2017 | 10 | 9 |
| 2018 | 12 | 9 |
| 2019 | 11 | 6 |
| 2020 | 8 | 6 |
| 2021 | 6 | 7 |
| 2022 | 9 | 6 |
| 2023 | 3 | 7 |
| 2024 | 10 | 7 |
| 2025 | 6 | 1 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device and method for peeling off protective films from plate-shaped objects26 May 2026US 12,636,873 B2Advanced Engineering Industrie Automation GmbH
- Method and apparatus for substrate and spacer separation7 Oct 2025US 12,434,467 B2Western Digital Technologies, Inc.
- Removal shaft30 Sep 2025US D1,095,353 S1TSC International Products, LLC · Design
- Wafer separation apparatus and method, and method for manufacturing silicon wafer2 Sep 2025US 12,406,863 B2Sumco Corporation
- Film removal apparatus and uncovering mechanism26 Aug 2025US 12,400,884 B2Wistron Corporation
- Method and apparatus for substrate and spacer separation2 Jan 2025US 2025/0001752 A1Western Digital Technologies, Inc.
- Film removal apparatus and uncovering mechanism26 Dec 2024US 2024/0429072 A1Wistron Corporation
- Heat stamp and method for releasing protective tape using heat stamp26 Sep 2024US 2024/0321606 A1Kabushiki Kaisha Toshiba
- Apparatus for manufacturing display device and method for manufacturing display device11 Jul 2024US 2024/0227381 A9Samsung Display Co., Ltd.
- Device and method for peeling off protective films from plate-shaped objects27 Jun 2024US 2024/0208199 A1Advanced Engineering Industrie Automation GmbH
Most cited
By later US patents
- Method for separating a film and a substrate52US 6,974,521 B2Katholieke Universiteit Nijmegen · 2005
- Label peeling machine47US 8,646,508 B2Towa Seiko Co., Ltd. · 2014
- Tape removal apparatus and process42US 8,029,642 B2The Boeing Company · 2011
- De-laminator apparatus and method with leader diverter33US 5,478,434 AEastman Kodak Company · 1995
- Apparatus for removing protective films33US 5,540,809 ACanon Kabushiki Kaisha · 1996