Film removal apparatus and uncovering mechanism
AssigneeWistron Corporation
InventorsZeshan Yan, Shun-Chi Yeh, Fuhua Yan, Chen Qin
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Abstract
This disclosure relates to a film removal apparatus that is suitable for uncovering a film of a semiconductor substrate and includes a carrier, an uncovering mechanism and a lifting mechanism. The carrier supports the semiconductor substrate. The uncovering mechanism includes a slider, a guider and a roller. The slider is slidably disposed on the carrier. The guider is fixed to the slider. The roller is rotatably disposed on the slider and arranged beside the guider. The uncovering mechanism is to uncover the film from the semiconductor substrate. The lifting mechanism selectively separates the semiconductor substrate away from the carrier.
Claims19
A film removal apparatus, suitable for uncovering a film of a semiconductor substrate, the film removal apparatus comprising:
- a carrier, supporting the semiconductor substrate;
- an uncovering mechanism, comprising a slider, a guider and a roller, wherein the slider is slidably disposed on the carrier, the guider is fixed to the slider, and the roller is rotatably disposed on the slider and arranged beside the guider, and the uncovering mechanism is to uncover the film from the semiconductor substrate;
- and
- a lifting mechanism, selectively separating the semiconductor substrate away from the carrier.
An uncovering mechanism, suitable for uncovering a film of a semiconductor substrate located on a carrier, the uncovering mechanism comprising:
- a slider, slidably disposed on the carrier;
- a guider, fixed to the slider;
- a roller, rotatably disposed on the slider and arranged beside the guider;
- and
- a plurality of wheels, rotatably disposed on the slider and placed on the carrier.
Dependencies are inferred from the claim text.