Y10T 156/1126
Using direct fluid current against work during delaminating
Y10T156/1126 (Using direct fluid current against work during delaminating) appears on 388 US grants and 362 published applications in this corpus.
Search patents in Y10T- Granted patents
- 388
- Published applications
- 362
- Assignees
- 217
- Inventors
- 775
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 3 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 7 | 0 |
| 2000 | 15 | 0 |
| 2001 | 8 | 0 |
| 2002 | 12 | 10 |
| 2003 | 5 | 17 |
| 2004 | 8 | 8 |
| 2005 | 10 | 15 |
| 2006 | 6 | 11 |
| 2007 | 8 | 11 |
| 2008 | 6 | 11 |
| 2009 | 6 | 14 |
| 2010 | 14 | 17 |
| 2011 | 11 | 23 |
| 2012 | 22 | 16 |
| 2013 | 20 | 19 |
| 2014 | 14 | 28 |
| 2015 | 19 | 33 |
| 2016 | 32 | 30 |
| 2017 | 33 | 18 |
| 2018 | 24 | 13 |
| 2019 | 19 | 13 |
| 2020 | 11 | 13 |
| 2021 | 11 | 12 |
| 2022 | 17 | 9 |
| 2023 | 8 | 8 |
| 2024 | 7 | 6 |
| 2025 | 2 | 3 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Peeling system and peeling method for flexible fingerprint component14 Jul 2026US 12,679,083 B2Beijing BOE Sensor Technology Co., Ltd.
- Systems and methods of automatic film removal12 May 2026US 12,623,368 B2General Electric Company
- Composite backing layer peel starter12 May 2026US 12,623,449 B2The Boeing Company
- Substrate processing apparatus and substrate processing method5 May 2026US 12,622,206 B2Tokyo Electron Limited
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same5 May 2026US 12,622,207 B2Adeia Semiconductor Bonding Technologies Inc.
- Systems and methods of automatic film removal3 Sep 2026US 2026/0257390 A1General Electric Company
- Apparatus for separating singulated die from substrate dicing tape and methods of using the same20 Aug 2026US 2026/0247905 A1Adeia Semiconductor Bonding Technologies Inc.
- Substrate processing apparatus and substrate processing method13 Aug 2026US 2026/0239913 A1Tokyo Electron Limited
- Substrate bonding device, calculation device, substrate bonding method, and calculation method6 Aug 2026US 2026/0231716 A1SCREEN Holdings Co., Ltd.
- Systems and methods of automatic film removal24 Apr 2025US 2025/0128444 A1General Electric Company
Most cited
By later US patents
- Peeling method and method of manufacturing semiconductor device137US 7,351,300 B2Semiconductor Energy Laboratory Co.Ltd. · 2008
- Apparatus and methods for wafer debonding using a liquid jet76US 5,783,022 ASamsung Electronics Co., Ltd. · 1998
- Film removing method and film removing agent59US 5,632,847 AChlorine Engineers Corp., Ltd. · 1997
- Method of die bonding electronic component and die bonding apparatus thereof58US 6,176,966 B1Lintec Corporation · 2001
- Laser-based system and method for stripping coatings from substrates56US 5,662,762 AClover Industries, Inc. · 1997