Y10T 156/1132
Using vacuum directly against work during delaminating
Y10T156/1132 (Using vacuum directly against work during delaminating) appears on 236 US grants and 232 published applications in this corpus.
Search patents in Y10T- Granted patents
- 236
- Published applications
- 232
- Assignees
- 153
- Inventors
- 539
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 10 | 0 |
| 2001 | 5 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 4 |
| 2004 | 1 | 6 |
| 2005 | 2 | 7 |
| 2006 | 5 | 7 |
| 2007 | 6 | 9 |
| 2008 | 4 | 6 |
| 2009 | 5 | 6 |
| 2010 | 11 | 14 |
| 2011 | 6 | 18 |
| 2012 | 15 | 12 |
| 2013 | 16 | 13 |
| 2014 | 9 | 17 |
| 2015 | 14 | 22 |
| 2016 | 22 | 20 |
| 2017 | 26 | 13 |
| 2018 | 11 | 10 |
| 2019 | 14 | 8 |
| 2020 | 8 | 6 |
| 2021 | 3 | 8 |
| 2022 | 11 | 6 |
| 2023 | 6 | 6 |
| 2024 | 4 | 5 |
| 2025 | 2 | 3 |
| 2026 | 6 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Substrate processing apparatus and substrate processing method13 Aug 2026US 2026/0239913 A1Tokyo Electron Limited
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Most cited
By later US patents
- Method of die bonding electronic component and die bonding apparatus thereof58US 6,176,966 B1Lintec Corporation · 2001
- Laser-based system and method for stripping coatings from substrates56US 5,662,762 AClover Industries, Inc. · 1997
- Method of forming a conduit using a wound sacrificial layer56US 7,291,240 B2Fisher & Paykel Healthcare Limited · 2007
- Method and apparatus for removing die from a wafer and conveying die to a pickup location53US 6,173,750 B1Hover-Davis, Inc. · 2001
- System and method for dicing semiconductor components52US 6,136,137 AMicron Technology, Inc. · 2000