System and method for dicing semiconductor components
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood
Life of this patent
Estimating the term…
Abstract
A method and system for dicing semiconductor components, such as bare dice and chip scale packages, are provided. Initially, the semiconductor components are contained on a wafer or a panel. Next, an insert that includes a base and an adhesive layer, is used to support the substrate for separation into separate components by sawing or other process. The insert with the separated components retained thereon, is then transferred to a carrier tray constructed according to JEDEC standards. The carrier tray is adapted for stacking and for handling by conveyors, magazines and other standard equipment. The system includes the substrate, the insert, and the standardized carrier tray.
Claims37
A method for dicing a substrate comprising a plurality of semiconductor components comprising:
- providing an insert configured to retain the substrate;
- separating the substrate into the components, with the substrate and the components retained on the insert;
- providing a carrier tray comprising a retention member configured to retain the insert and a plurality of features configured for use with transport equipment;
- mounting the insert with the components thereon to the carrier tray;
- and
- transporting the carrier tray with the insert and the components thereon using the transport equipment.
A method for dicing a substrate comprising a plurality of semiconductor components comprising:
- providing an insert comprising a base and a first retention member on the base;
- placing the substrate on the first retention member;
- separating the substrate into the components with the substrate and the components retained by the retention member;
- providing a carrier tray comprising a second retention member configured to retain the insert and a plurality of features configured for use with transport equipment;
- following the separating step, placing the insert on the carrier tray with the components retained by the first retention member and the insert retained by the second retention member;
- and
- transporting the carrier tray with the insert and the components thereon using the transport equipment.
A method for dicing a substrate comprising a plurality of semiconductor components comprising:
- providing an insert comprising a base and an adhesive member on the base;
- providing a carrier tray comprising a retention member configured to retain the insert and a plurality of features configured to permit transport of the carrier tray using selected equipment;
- placing the substrate on the adhesive member;
- separating the substrate into the components with the substrate and the components retained by the adhesive member;
- mounting the insert on the carrier tray with the insert retained by the retention member and the components retained by the adhesive member;
- transporting the carrier tray using the selected equipment with the insert mounted thereto.
A method for dicing a substrate comprising a plurality of semiconductor components comprising:
- providing an insert comprising a base and an adhesive member;
- providing a carrier tray comprising a retention member configured to retain the insert, the carrier tray having a peripheral configuration and a plurality of external features that permit the carrier tray to be handled by equipment;
- placing the substrate on the adhesive member;
- separating the substrate into the components with the substrate and the components retained by the adhesive member;
- placing the insert on the carrier tray with the carrier tray retained by the retention member and the components retained by the adhesive member;
- and
- handling the carrier tray with the insert and the components thereon using the equipment.
A method for dicing a substrate comprising a plurality of semiconductor packages comprising:
- providing an insert comprising a base and an adhesive member;
- placing the substrate on the adhesive member;
- separating the substrate into the packages with the substrate and packages retained by the adhesive member;
- providing a carrier tray comprising a retention member configured to retain the insert, the carrier tray having a peripheral outline and a plurality of features that permit the carrier tray to be handled by equipment;
- following the separating step, mounting the insert to the carrier tray with the packages retained by the adhesive member;
- and
- handling the carrier tray with the insert mounted thereto and with the packages on the insert using the equipment.
A system for dicing a substrate comprising a plurality of semiconductor components comprising:
- an insert comprising a base and an adhesive member on the base configured to retain the substrate on the base for separation into the components;
- and
- a carrier tray configured for transporting the insert with the components thereon, the carrier tray comprising a retention member configured to retain the insert and a plurality of external features configured to permit the carrier tray to be handled with the insert and the components thereon by selected equipment.
A system for dicing a substrate comprising a plurality of semiconductor components comprising:
- a carrier tray comprising:
- a pair of side rails and a pair of end rails having a size, a peripheral configuration and a plurality of features that permit the carrier tray to be handled by selected equipment;
- a support member attached to the side rails or to the end rails;
- a first retention member attached to the side rails or to end rails;
- and
- an insert comprising a base and a second retention member configured to retain the substrate on the base for separation into the components, the insert configured for placement on the support member and for retention by the first retention member.
A system for dicing a substrate comprising a plurality of semiconductor components comprising:
- an insert comprising a base and an adhesive member on the base configured to retain the substrate for separation into the components;
- and
- a carrier tray configured to retain and transport the insert with the components thereon, the carrier tray comprising:
- a pair of side rails and a pair of end rails having a size and a peripheral configuration configured to allow the carrier tray with the insert and the components thereon to be handled by equipment;
- a support member attached to the side rails or to the end rails and configured to support the insert with the components thereon;
- a retention member attached to the side rails or to end rails and configured to engage a portion of the insert to retain the insert on the support member;
- and
- a clip member attached to the side rails or to the end rails and configured to bias the insert against the retention member.
A system for dicing a substrate comprising a plurality of semiconductor components comprising:
- an insert comprising a base comprising a vacuum chamber and an adhesive membrane stretched across the vacuum chamber, the adhesive membrane configured to retain the substrate on the base for separation into the components and deformable upon application of a vacuum to the vacuum chamber to release the components;
- and
- a carrier tray comprising a plurality of external features that permit the carrier tray with the insert and the components thereon to be transported by selected equipment, the carrier tray comprising a first member for supporting the insert, and a second member for retaining the insert on the support member.
Dependencies are inferred from the claim text.