Y10S 438/928
Front and rear surface processing
Y10S438/928 (Front and rear surface processing) appears on 422 US grants and 159 published applications in this corpus.
Search patents in Y10S- Granted patents
- 422
- Published applications
- 159
- Assignees
- 175
- Inventors
- 629
- Latest grant
- 27 Mar 2018
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 6 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 5 | 0 |
| 1983 | 5 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 7 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 9 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 8 | 0 |
| 1994 | 17 | 0 |
| 1995 | 13 | 0 |
| 1996 | 18 | 0 |
| 1997 | 17 | 0 |
| 1998 | 23 | 0 |
| 1999 | 23 | 0 |
| 2000 | 23 | 0 |
| 2001 | 23 | 9 |
| 2002 | 29 | 28 |
| 2003 | 21 | 19 |
| 2004 | 16 | 18 |
| 2005 | 18 | 29 |
| 2006 | 15 | 13 |
| 2007 | 12 | 5 |
| 2008 | 14 | 9 |
| 2009 | 12 | 7 |
| 2010 | 10 | 5 |
| 2011 | 12 | 8 |
| 2012 | 8 | 5 |
| 2013 | 3 | 2 |
| 2014 | 1 | 0 |
| 2015 | 3 | 1 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Semiconductor device and manufacturing method thereof27 Mar 2018US 9,929,190 B2Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device and manufacturing method thereof29 Nov 2016US 9,508,620 B2Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device and manufacturing method thereof29 Dec 2015US 9,224,667 B2Semiconductor Energy Laboratory Co.Ltd.
- Integrated circuit package with open substrate and method of manufacturing thereof19 May 2015US 9,034,693 B2ST Assembly Test Services Ltd.
- Silicon wafer and method for heat-treating silicon wafer7 Apr 2015US 8,999,864 B2Global Wafers Japan Co., Ltd.
- Semiconductor device and manufacturing method thereof16 Feb 2017US 2017/0047359 A1Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device and manufacturing method thereof29 Oct 2015US 2015/0311439 A1Semiconductor Energy Laboratory Co.Ltd.
- Semiconductor device and manufacturing method thereof22 Aug 2013US 2013/0214434 A1Semiconductor Energy Laboratory Co.Ltd.
- Gan based group iii-v nitride semiconductor light-emitting diode and method for fabricating the same11 Apr 2013US 2013/0087764 A1Samsung Electro-Mechanics Co., Ltd.
- Semiconductor device and manufacturing method thereof23 Aug 2012US 2012/0211874 A1Semiconductor Energy Laboratory Co.Ltd.
Most cited
By later US patents
- Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bonding580US 5,821,138 ASemiconductor Energy Laboratory Co.Ltd. · 1998
- Single chip modules, repairable multichip modules, and methods of fabrication thereof552US 5,841,193 AEPIC Technologies, Inc. · 1998
- Uniform dielectric film deposition on textured surfaces542US 5,801,104 AMicron Technology, Inc. · 1998
- Multi-layer type semiconductor device with semiconductor element layers stacked in opposite directions and manufacturing method thereof319US 5,189,500 AMitsubishi Denki Kabushiki Kaisha · 1993
- Multi-layer type semiconductor device with semiconductor element layers stacked in opposite direction and manufacturing method thereof319US 5,324,980 AMitsubishi Denki Kabushiki Kaisha · 1994