Y10S 430/116
Redox or dye sensitizer
Y10S430/116 (Redox or dye sensitizer) appears on 154 US grants and 22 published applications in this corpus.
Search patents in Y10S- Granted patents
- 154
- Published applications
- 22
- Assignees
- 65
- Inventors
- 311
- Latest grant
- 12 Jun 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 2 | 0 |
| 1988 | 6 | 0 |
| 1989 | 9 | 0 |
| 1990 | 16 | 0 |
| 1991 | 13 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 6 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 5 | 0 |
| 2002 | 1 | 3 |
| 2003 | 3 | 5 |
| 2004 | 3 | 5 |
| 2005 | 4 | 1 |
| 2006 | 1 | 2 |
| 2007 | 0 | 1 |
| 2008 | 2 | 0 |
| 2009 | 3 | 3 |
| 2010 | 1 | 2 |
| 2011 | 3 | 0 |
| 2012 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board12 Jun 2012US 8,198,008 B2Hitachi Chemical Company, Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board5 Jun 2012US 8,192,916 B2Hitachi Chemical Company, Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board9 Aug 2011US 7,993,809 B2Hitachi Chemical Company, Ltd.
- Photosensitive resin composition, method for preparing the same, and dry film resist comprising the same19 Apr 2011US 7,927,781 B2Dongjin Semichem Co., Ltd.
- Resist composition and method of pattern formation with the same29 Mar 2011US 7,914,965 B2FUJIFILM Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board11 Nov 2010US 2010/0285408 A1Hitachi Chemical Company, Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board4 Nov 2010US 2010/0279229 A1Hitachi Chemical Company, Ltd.
- Laser coloration of coated substrates23 Jul 2009US 2009/0186758 A1Appleton Papers Inc.
- Photosensitive resin composition, method for preparing the same, and dry film resist comprising the same28 May 2009US 2009/0136872 A1Dongjin Semichem Co., Ltd.
- Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board29 Jan 2009US 2009/0029289 A1Hitachi Chemical Company, Ltd.
Most cited
By later US patents
- Ternary photoinitiator system for addition polymerization289US 5,545,676 AMinnesota Mining and Manufacturing Company · 1996
- Fluorinated xanthene derivatives146US 6,162,931 AMolecular Probes, Inc. · 2000
- Support for liquid photosensitive resin137US 3,948,666 ATeijin Limited · 1976
- Photosensitive composition and photopolymerizable composition employing the same95US 4,997,745 AFuji Photo Film Co., Ltd. · 1991
- UV/EB curable copolymers for lithographic and corrosion-resistant coating applications91US 5,376,503 AExxon Chemical Patents Inc. · 1994