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US 7,993,809 B2Granted
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasahiro Miyasaka, Takashi Kumaki
Life of this patent
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Abstract
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
Claims10
A method of forming a resist pattern, comprising:
- forming a photosensitive layer comprising a photosensitive resin composition on a substrate, wherein the photosensitive resin composition comprises:
- (A) a binder polymer;
- (B) a photopolymerizable compound that has an ethylenically unsaturated bond;
- (C1) a compound represented by general formula (1) below,
- wherein, at least one R represents a C4-12 alkyl group;
- the sum of a, b, and c is 1 to 6;
- and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another;
- and
- (C2) a 2,4,5-triarylimidazole dimer or a derivative thereof,
- wherein the content of the component (C1) is 0.05 to 0.8 mass parts per 100 mass parts of the total content of components (A) and (B), and the content of the component (C2) is 3 to 5 mass parts per 100 mass parts of the total content of components (A) and (B)
- exposing prescribed regions of the photosensitive layer to light by a direct exposure imaging technique;
- and
- developing the exposed photosensitive layer to form a resist pattern.
10 more elements
Dependencies are inferred from the claim text.