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US 8,192,916 B2Granted
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasahiro Miyasaka, Takashi Kumaki
Life of this patent
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Abstract
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
Claims16
A photosensitive resin composition comprising:
- (A) a binder polymer having a weight-average molecular weight of 40,000 to 80,000;
- (B) a photopolymerizable compound that has an ethylenically unsaturated bond;
- and
- (C1) a compound represented by general formula (1) below,
- wherein, at least one R represents a C1-10alkoxy group;
- the sum of a, b, and c is 1 to 6;
- and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
4 more elements
Dependencies are inferred from the claim text.