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US 2010/0285408 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorsMasahiro MIYASAKA, Takashi Kumaki
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Abstract
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
Claims17
A photosensitive resin composition comprising:
- (A) a binder polymer;
- (B) a photopolymerizable compound that has an ethylenically unsaturated bond;
- and
- (C1) a compound represented by general formula (1) below,
- wherein, at least one R represents a C1-10 alkoxy group;
- the sum of a, b, and c is 1 to 6;
- and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
4 more elements
Dependencies are inferred from the claim text.