Y10S 414/139
Including wafer charging or discharging means for vacuum chamber
Official title: including wafer charging or discharging means for vacuum chamber
Y10S414/139 (Including wafer charging or discharging means for vacuum chamber) appears on 926 US grants and 449 published applications in this corpus.
Search patents in Y10S- Granted patents
- 926
- Published applications
- 449
- Assignees
- 251
- Inventors
- 1,338
- Latest grant
- 26 Sep 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 11 | 0 |
| 1986 | 9 | 0 |
| 1987 | 21 | 0 |
| 1988 | 17 | 0 |
| 1989 | 23 | 0 |
| 1990 | 17 | 0 |
| 1991 | 9 | 0 |
| 1992 | 6 | 0 |
| 1993 | 11 | 0 |
| 1994 | 18 | 0 |
| 1995 | 32 | 0 |
| 1996 | 23 | 0 |
| 1997 | 28 | 0 |
| 1998 | 27 | 0 |
| 1999 | 43 | 0 |
| 2000 | 58 | 0 |
| 2001 | 59 | 44 |
| 2002 | 78 | 61 |
| 2003 | 55 | 62 |
| 2004 | 65 | 51 |
| 2005 | 50 | 48 |
| 2006 | 20 | 23 |
| 2007 | 27 | 29 |
| 2008 | 22 | 38 |
| 2009 | 18 | 24 |
| 2010 | 35 | 17 |
| 2011 | 24 | 12 |
| 2012 | 23 | 11 |
| 2013 | 14 | 12 |
| 2014 | 19 | 7 |
| 2015 | 16 | 5 |
| 2016 | 3 | 2 |
| 2017 | 4 | 0 |
| 2018 | 5 | 0 |
| 2019 | 1 | 2 |
| 2020 | 4 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wafer transfer apparatus and substrate transfer apparatus26 Sep 2023US RE49,671 E1Kawasaki Jukogyo Kabushiki Kaisha
- Substrate processing apparatus with an air curtain in a loading/unloading part5 Sep 2023US 11,749,549 B2Kctech Co., Ltd.
- Wafer transfer apparatus and substrate transfer apparatus26 Oct 2021US RE48,792 E1Kawasaki Jukogyo Kabushiki Kaisha
- Substrate transporting device, substrate treating apparatus, and substrate transporting method28 Jul 2020US 10,727,087 B2SCREEN Holdings Co., Ltd.
- Method and apparatus for plasma dicing a semi-conductor wafer7 Jul 2020US 10,707,060 B2Plasma-Therm LLC
- Apparatus for processing substrate17 Sep 2020US 2020/0294832 A1Kctech Co., Ltd.
- Substrate transporting device, substrate treating apparatus, and substrate transporting method7 Feb 2019US 2019/0043738 A1SCREEN Holdings Co., Ltd.
- Method and apparatus for plasma dicing a semi-conductor wafer10 Jan 2019US 2019/0013243 A1Plasma-Therm LLC
- Substrate transporting device, substrate treating apparatus, and substrate transporting method6 Oct 2016US 2016/0293465 A1SCREEN Holdings Co., Ltd.
- Method and Apparatus for Plasma Dicing a Semi-conductor Wafer21 Apr 2016US 2016/0111332 A1Plasma-Therm LLC
Most cited
By later US patents
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Wafer processing cluster tool batch preheating and degassing apparatus663US 5,259,881 AMaterials Research Corporation · 1993
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Modular wafer transport and processing system655US 4,917,556 AVarian Associates, Inc. · 1990