Method and apparatus for plasma dicing a semi-conductor wafer

A method for plasma dicing a substrate, the method comprising:

• providing a transfer arm;
• providing a process chamber having a wall;
• providing a plasma source adjacent to the wall of the process chamber;
• providing a work piece support within the process chamber;
• providing a lifting mechanism within the work piece support;
• placing the substrate onto a support film on a frame to form the work piece, the frame having an underside;
• placing the work piece onto the transfer arm, the transfer arm contacting the underside of the frame;
• transferring the work piece into the process chamber onto the lifting mechanism using the transfer arm, the lifting mechanism contacting the underside of the frame;
• generating a plasma through the plasma source;
• and
• etching the work piece through the generated plasma.