Wafer transfer apparatus and substrate transfer apparatus
AssigneeKawasaki Jukogyo Kabushiki Kaisha
InventorYasuhiko Hashimoto
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AssigneeKawasaki Jukogyo Kabushiki Kaisha
InventorYasuhiko Hashimoto
Estimating the term…
A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R≤B−L0).
A wafer transfer apparatus for transferring a wafer, comprising:
A substrate transfer apparatus for transferring a substrate, relative to a substrate processing apparatus for processing the substrate, comprising:
A wafer transfer apparatus for transferring a wafer, comprising:
A substrate transfer apparatus for transferring a substrate, relative to a substrate processing apparatus for processing the substrate, comprising:
A substrate transfer apparatus for transferring a substrate, comprising:
Dependencies are inferred from the claim text.