Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
AssigneePlasma-Therm LLC
InventorsLinnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
Life of this patent
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Abstract
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.
Claims21
1-32. (canceled)
An apparatus for plasma dicing a substrate comprising:
- a process chamber having a wall;
- a plasma source adjacent to the wall of the process chamber;
- a work piece support within the process chamber, the work piece support having an electrostatic chuck;
- and
- a work piece having the substrate on a support film on a frame, the frame of the work piece contacting the electrostatic chuck.
An apparatus for plasma dicing a substrate comprising:
- a process chamber having a wall;
- a plasma source adjacent to the wall of the process chamber;
- a cover ring connected to the wall of the process chamber;
- a work piece support within the process chamber, the work piece support having an electrostatic chuck;
- and
- a work piece having the substrate on a support film on a frame, the frame of the work piece is positioned at a distance from the cover ring and the frame is positioned on the electrostatic chuck.
An apparatus for plasma dicing a substrate comprising:
- a process chamber having a wall;
- a plasma source adjacent to the wall of the process chamber;
- a cover ring connected to the wall of the process chamber;
- a work piece support within the process chamber, the work piece support having an electrostatic chuck;
- a work piece having the substrate on a support film on a frame, the frame of the work piece is positioned at a distance from the cover ring and the frame is positioned on the electrostatic chuck;
- a lifting mechanism, said lifting mechanism contacting an underside of the frame of the work piece;
- and
- a transfer arm, said transfer arm contacting the frame of the work piece.
Dependencies are inferred from the claim text.