Y10S 257/916
Narrow band gap semiconductor material, <<1ev
Y10S257/916 (Narrow band gap semiconductor material, <<1ev) appears on 50 US grants and 10 published applications in this corpus.
Search patents in Y10S- Granted patents
- 50
- Published applications
- 10
- Assignees
- 29
- Inventors
- 95
- Latest grant
- 1 May 2018
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 12 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 1 |
| 2004 | 1 | 1 |
| 2005 | 1 | 3 |
| 2006 | 1 | 0 |
| 2007 | 2 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Passive within via1 May 2018US 9,960,079 B2Intel Corporation
- Method of embedding passive component within via16 Jul 2013US 8,487,446 B2Intel Corporation
- Method of embedding passive component within via31 May 2011US 7,952,202 B2Intel Corporation
- Surface mount multichip devices28 Apr 2009US 7,525,183 B2General Semiconductor, Inc.
- Method of embedding passive component within via2 Oct 2007US 7,275,316 B2Intel Corporation
- Passive within via26 Sep 2013US 2013/0249112 A1Intel Corporation
- Method of embedding passive component within via18 Aug 2011US 2011/0198723 A1Intel Corporation
- Method of embedding passive component within via5 Mar 2009US 2009/0057910 A1Intel Corporation
- Surface mount multichip devices24 Jan 2008US 2008/0017959 A1General Semiconductor, Inc.
- Surface mount multichip devices10 Nov 2005US 2005/0248007 A1General Semiconductor, Inc.
Most cited
By later US patents
- Semiconductor device and a method for fabricating the same154US 4,984,059 AFujitsu Limited · 1991
- Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards138US 5,027,253 AIBM Corporation · 1991
- Embedded capacitor assembly in a package83US 6,346,743 B1Intel Corporation · 2002
- Component module for piggyback mounting on a circuit package having dual-in-line leads78US 4,521,828 AAT&T Technologies, Inc. · 1985
- Packaged integrated circuit with in-cavity decoupling capacitors68US 5,103,283 A1992