Back to results
US 7,952,202 B2Granted
Method of embedding passive component within via
AssigneeIntel Corporation
InventorsTodd B Myers, Nicholas R. Watts, Eric C Palmer, Jui Min Lim
Life of this patent
Estimating the term…
Abstract
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
Claims11
A substrate comprising:
- a first conductive layer;
- a second conductive layer substantially electrically isolated from the first conductive layer by a dielectric material;
- a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, the via having a first side and a second side, the dielectric material being between the first side and the second side, wherein the via further comprises:
- a first plate located on the first side of the via, wherein none of a material of the first plate is located on the second side of the via, a first electrical path from the first conductive layer to the first plate;
- and
- a second plate located on the second side of the via, wherein none of a material of the second plate is located on the first side of the via, a second electrical path from the second conductive layer to the second plate.
3 more elements
A substrate comprising:
- a first conductive layer;
- a second conductive layer substantially electrically isolated from the first conductive layer by a dielectric material;
- a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, the via having a first side and a second side, the dielectric material being between the first side and the second side, wherein the via further comprises:
- a first portion located on the first side of the via, wherein none of a material of the first portion is located on the second side of the via, a first electrical path from the first conductive layer to the first portion;
- and
- a second portion located on the second side of the via, wherein none of a material of the second portion is located on the first side of the via, a second electrical path from the second conductive layer to the second portion.
3 more elements
Dependencies are inferred from the claim text.