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US 7,275,316 B2Granted
Method of embedding passive component within via
AssigneeIntel Corporation
InventorsTodd B Myers, Nicholas R. Watts, Eric C Palmer, Jui Min Lim
Life of this patent
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Abstract
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
Claims13
A method comprising:
- forming a via in a substrate;
- removing a portion of the via in the substrate to form a first via portion and a second via portion;
- and
- forming an electrical component in the via in the substrate, wherein removing a portion of the via in the substrate to form a first via portion and a second via portion further includes:
- masking a portion of the via;
- and
- etching an unmasked portion of the via.
4 more elements
Dependencies are inferred from the claim text.