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US 2009/0057910 A1Published application
Method of embedding passive component within via
AssigneeIntel Corporation
InventorsTodd B. Myers, Nicholas R. Watts, Eric C. Palmer, Jui Min Lim
Life of this patent
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Abstract
A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
Claims14
A substrate comprising:
- a first conductive layer;
- a second conductive layer substantially electrically isolated from the first conductive layer;
- a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, wherein the via further comprises:
- a first plate, a first electrical path from the first conductive layer to the first plate;
- and
- a second plate, a second electrical path from the second conductive layer to the second plate.
3 more elements
A substrate comprising:
- a first conductive layer;
- a second conductive layer substantially electrically isolated from the first conductive layer;
- a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, wherein the via further comprises:
- a first portion within the via, a first electrical path from the first conductive layer to the first portion;
- and
- a second portion within the via, a second electrical path from the second conductive layer to the second portion.
3 more elements
A substrate comprising:
- a first conductive layer;
- a second conductive layer substantially electrically isolated from the first conductive layer;
- and
- a via for connecting an electrical portion of a circuit on the first conductive layer to an electrical portion of a circuit on the second conductive layer, wherein the via further comprises:
- a first magnetizable portion lining the via;
- an electrical path from the first conductive layer to the second conductive layer;
- and
- an insulator separating the first magnetizable portion from the electrical path.
5 more elements
Dependencies are inferred from the claim text.