Y10S 206/833
Apertured side walls
Y10S206/833 (Apertured side walls) appears on 30 US grants and 3 published applications in this corpus.
Search patents in Y10S- Granted patents
- 30
- Published applications
- 3
- Assignees
- 17
- Inventors
- 35
- Latest grant
- 28 Mar 2006
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Wafer protective cassette28 Mar 2006US 7,017,758 B2Chartered Semiconductor Manufacturing Ltd.
- Packaging device and method for absorbing moisture28 Feb 2006US 7,005,035 B2
- Composite can and method of making same25 Jun 2002US 6,409,078 B1Sonoco Development, Inc.
- Silicon wafer carrier31 Jul 2001US 6,268,030 B1Teijin Limited
- Thermal processing jig for use in manufacturing semiconductor devices and method of manufacturing the same12 Jun 2001US 6,245,147 B1Fujitsu Limited
Most cited
By later US patents